01Driver Architecture
Based on the TFT architecture, it is equipped with a dedicated driver IC, simulating PWM mixed driving, and it can achieve high brightness, rich colors, and can be applied to multiple use scenarios.
02Bin Technology
By achieving uniform quality of all connected modules, it can make the integration of a unified screen a reality.
03Seamless splicing
“0” gap, custom-made, and infinite freedom to connect the screen.
04Mass Transfer
High quality, high lighting rate and high production efficiency
05TFT backplane
TFT backplane technology, through its unique materials and manufacturing process, provides micro LED display technology with the advantages of high performance and multi-function, and meets the diversity and high standards of modern display needs
Driver Architecture
Bin Technology
Seamless splicing
Mass Transfer
TFT Backplane
High Contrast
Based on the characteristics of micro LED pixel level self illumination, comBined with the reprocessing technology of the packaging layer, the reflectivity of the screen can reach below 5%, which can achieve very high contrast and perfectly show the extreme black state.
Micro-LED Dedicated Driver IC
Micro led special driver IC realizes 10 bit color depth, presenting a colorful and hierarchical picture
Cool Screen Technology
With the high transmission packaging technology, lower screen power consumption at the same LED chip level can be realized. With efficient heat dissipation design, the cold screen technology can be realized
High Brightness HDR Display
Brightness 600 nits, peak brightness 2000 nits
Color Calibration Technology
Wide color gamut dci-p3 99%, realizing film level color gamut standard, and real and delicate color expression
LED Post-processing Technology
It can effectively solve the pain points of poor brightness and wavelength consistency of LED devices, and improve the consistency of display image quality between boxes by using massive detection and secondary arrangement technology
Seamless Splicing Technology
Based on the side-edge process, it can completely achieve a seamless stitching box, and the module can be freely connected to form a single display box.
Ink Color Consistency
Due to the smaller thickness difference of the glass panel, it can more accurately control the thickness of the encaps layer, and effectively improve the ink color consistency between boxes. It can also weak the mura caused by the stitching position, and ensure a smooth transition of the display image.
De-mura Solution
Through the use of a unique De-mura scheme, the brightness and color of the display image on different boxes are uniformly processed, and the mura caused by the stitching position is effectively solved. This makes it impossible for users to notice that the display is composed of multiple boxes, and the display image is nearly perfect.
High Yield Rate
By using the massive transfer and repair technology, the high-efficiency and high yield transfer of 25umled chip is realized. ComBined with the high-precision detection algorithm of independent intellectual property rights, the position accuracy of the transfer is optimized several times. The one-time transfer yield is as high as 99.995%, and the repaired yield is 100%
Repair Technology
Due to the introduction of the double-sided backplane process, the straight through yield of the screen body is greatly challenged. CHENXIAN optoelectronics has developed the rear module repair technology with independent intellectual property rights, and has conducted redundant design for the high failure risk positions of the screen body, so as to improve the straight through yield of the screen body and provide an effective guarantee for reducing production costs
Excellent optical properties
TFT backplane technology provides ultra-high transparency and excellent optical performance through the use of glass substrates. This advantage in optical performance makes TFT backplane technology particularly suitable for micro LED display applications requiring high brightness, high contrast and wide viewing angle, such as high-end TVs, professional monitors and large display screens
Good flatness and low coefficient of thermal expansion
The use of glass substrate also brings good flatness and low coefficient of thermal expansion, which is very important to maintain the long-term stability and reliability of micro LED display. The low coefficient of thermal expansion means that the TFT backplane has higher dimensional stability under temperature changes, reducing the stress caused by thermal expansion, thus extending the service life of the display
Fire resistance
TFT backplane technology also has excellent fire resistance performance, because the glass material itself has good fire resistance. In case of high temperature or fire, TFT backplane can effectively prevent the spread of fire, providing additional security for display equipment
High precision performance under micro spacing
In micro LED technology, micro spacing display is a major trend. TFT backplane technology can achieve high-precision pixel layout. Especially in micro spacing applications, it can provide more fine and uniform pixel distribution, so as to achieve higher resolution and better image quality
